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Polycarbonate and Special Polyamide for LDS (Laser Direct Structuring) Technology

Suitable to produce injection-molded MIDs for the LDS technology developed by LPKF Laser & Electronics AG.

Advantage of LDS technology:
①High design flexibility and integration of circuits on structural part
②Suitable for small sized curved surfaces and low wall thickness
③Miniaturization; distance between 2 tracks down to 100μm across
④Cost reduction for high quantities using LPKF Fusion 3D laser

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Portfolio
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MEP has the broadest portfolio of materials suitable for Laser Direct Structuring and covers the entire temperature range, including the demanding reflow soldering at 260degC.
Available grades;
For Low temperature applications (No or Special Soldering): Xantar, Iupilon (PC/ABS & PC)
For High temperature applications (Reflow Soldering): Reny (PA-MXD6)

Segmentation of LDS applications
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Product Info.

  • ポリカーボネート樹脂(PC樹脂)ユーピロンノバレックスザンター
  • ポリブチレン テレフタレート樹脂 (PBT樹脂) ノバデュラン
  • ポリアセタール樹脂(POM樹脂)ユピタール
  • 変性ポリフェニレン エーテル樹脂(m-PPE樹脂)ユピエースレマロイ
  • 高性能ポリアミド樹脂(PA樹脂)レニー
Basic Properties
Applications
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