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Polycarbonate and Special Polyamide for LDS (Laser Direct Structuring) Technology

Suitable to produce injection-molded MIDs using the LDS (Laser Direct Structuring) technology developed by LPKF Laser & Electronics AG.

Advantages of the LDS technology:
1. High design flexibility and integration of circuits on structural parts
2. Suitable for small/curved surfaces and thin-walled parts
3. Size reduction: distance between 2 circuit lines less than 100 μm possible
4. Cost reduction by using LPKF Fusion 3D laser

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Portfolio
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We have the broadest portfolio of materials suitable for the LDS, covering the entire temperature range, including the demanding reflow soldering at 260degC.
Available grades:
For Low temperature applications (No or Special Soldering): XANTAR and Iupilon (PC/ABS & PC)
For High temperature applications (Reflow Soldering): Reny (PA-MXD6)

Segmentation of LDS applications
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Product Info.

  • ポリカーボネート樹脂(PC樹脂)ユーピロンノバレックスザンター
  • ポリブチレン テレフタレート樹脂 (PBT樹脂) ノバデュラン
  • ポリアセタール樹脂(POM樹脂)ユピタール
  • 変性ポリフェニレン エーテル樹脂(m-PPE樹脂)ユピエースレマロイ
  • 高性能ポリアミド樹脂(PA樹脂)レニー
Basic Properties
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Applications
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