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High thermal conductive resin-Grade List-

In recent years, electronic devices are getting technically advanced and functionally complex. Huger traffic of signals and faster processing speed bring about increase in heat generation from electronic parts.
On the other hand, in order that devices may also become smaller and lighter, it has become more important how heat is managed than before.
Therefore, the demand of heat management using a thermal conductive resin to the parts consisted of a conventional resin is increasing.

There are following advantages by using thermal conductive resins which Mitsubishi Engineering-Plastics Corporation has developed.
1.Prevent malfunction due to temperature rise of device.
2.Enable to reduce the weight of parts as compared to metal.
3.The flexibility of design is larger than that of metal die-casting.
4.By integrating heat releasing parts and surrounding structural parts, the number of the parts and the cost can be reduced.

Thermal Conductivities


Product Info.

  • ポリカーボネート樹脂(PC樹脂)ユーピロンノバレックスザンター
  • ポリブチレン テレフタレート樹脂 (PBT樹脂) ノバデュラン
  • ポリアセタール樹脂(POM樹脂)ユピタール
  • 変性ポリフェニレン エーテル樹脂(m-PPE樹脂)ユピエースレマロイ
  • 高性能ポリアミド樹脂(PA樹脂)レニー
Basic Properties
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