High thermal conductive resin-Grade List-
Heat-transfer property : Test method
To valid heat-conductive effect of our thermal conductive resin, we compared heat-transfer property between PC+GF30% and the thermal conductive PC.
1. Materials |
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Heat-transfer property : Test results

In the case of the general PC, temperature increased only at the heater contact area.
In the case of the TPN1122, heat transferred to non-heater contact area. Effects by using thermal conductive resin are as follows:
- Reduction of thermal distortion and thermal degradation
- Reduction of warpage
- Increase of heat radiation area
Test : Temperature wave analysis method

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> The filler is oriented in the direction of resin flow. > Thermal conductivity of MD is the highest and that of thickness direction is not so high. |
CAE analysis : Conditions
Our resin is thermally-anisotropic (thermal conductivity in thickness direction is considerably-lower than those in plane directions).
We analyzed by CAE if it would be a big practical issue.
Analysis software : CAEFEMv8.3
Material constants |
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