Thermal conductiove resin | Mitsubishi Engineering-Plastics Corp.

Heat-transfer property : Test method

To valid heat-conductive effect of our thermal conductive resin, we compared heat-transfer property between PC+GF30% and the thermal conductive PC.

1. Materials
(a) PC+GF30wt% (Thermal conductivity : 0.3W/m/K)
(b) Thermal conductive PC ; TPN1122
　(Thermal conductivity ; 8.1W/m/K)

2. Test piece 100mm x 100m x 3mmt, Flat plate

3. Test conditions
> Feeding 3.2W to the rubber heater.
> Measuring the plate temperature by an infrared radiation thermometer.

Heat-transfer property : Test results

In the case of the general PC, temperature increased only at the heater contact area.
In the case of the TPN1122, heat transferred to non-heater contact area. Effects by using thermal conductive resin are as follows:

Reduction of thermal distortion and thermal degradation
Reduction of warpage
Increase of heat radiation area

Test : Temperature wave analysis method

> The filler is oriented in the direction of resin flow.

> Thermal conductivity of MD is the highest and that of thickness direction is not so high.

CAE analysis : Conditions

Our resin is thermally-anisotropic (thermal conductivity in thickness direction is considerably-lower than those in plane directions).
We analyzed by CAE if it would be a big practical issue.

Analysis software : CAEFEMv8.3
Analysis conditions
Model shape : 100x50x3mm, Flat plate
Analysis model : Hexahedral quadratic element 20x10x3mesh
Boundary condition : Loading 0.001W/mm2 heat flux to 30mm surface from end
Initial temperature : 20℃

Material constants
(a)Anisotropic body : λx= 8W/m/K, λy= 8W/m/K,
　λz=0.4W/m/K (thickness direction）
　C=0.14J/g/K r=1.2e-3g/mm3
(b)Isotropic body : λx= 8W/m/K λy= 8W/m/K
　λz=8W/m/K C=0.14J/g/K r=1.2e-3g/mm3