Compatible with the Laser Direct Structuring (LDS) technology of German company LPKF, enabling circuits to be formed on the surface of injection-molded articles
LPKF-LDS Technological Features
- Possible to form circuits on structural components, allowing for a high degree of design freedom
- Can be applied to small curved surfaces and thin-walled molded articles, allowing for downsizing and weight reduction of articles
- Circuit design and position can be changed at will in a short time
- Reduced costs thanks to fewer manufacturing processes and shorter assembly time
LPKF-LDS Process
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1. Injection molding of LDS-compatible resin (existing molds can be used) 
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2. Activation of irradiated area using LPKF laser (determining electrically conductive pattern design) 
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3. Electroless copper plating
(conductor pattern formation) of laser-irradiated area